清华大学机械工程系博士研究生导师简介：邹贵生

　　35. 邹贵生, 赵文庆, 吴爱萍, 张德库, 胡乃军, 黄庚华, 任家烈. Ti和Ti/Ni/Ti连接钨与铜及其合金的界面结合机制与接头强度. 航空材料学报. 2004, 24(3):36-42(EI: 04368345263)

　　34. 张德库, 吴爱萍, 邹贵生, 刘根茂, 杨俊, 任家烈. 原位生成法半固态连接Si3N4复相陶瓷的接头组织. 清华大学学报,2004,44(5): 613-615,619(EI: 04328306758)

　　33. 邹贵生, 张征, 胡乃军, 张德库, 吴爱萍, 易汉平, 韩征和, 李明亚, 顾晨. 以冷压为先导扩散连接高温超导带材. 中国材料科技与设备,2004,(4): 28-32

　　32. 杨俊, 吴爱萍, 邹贵生, 张德库, 刘根茂, 任家烈. Si3N4复相陶瓷半固态连接的接头组织与界面反应. 材料科学与工程学报. 2004, 22(2): 157-160

　　31. 邹贵生, 吴爱萍, 张德库, 白海林, 赵文庆, 任家烈. 以化学镀Ni-P为先导的陶瓷钎焊. 中国材料科技与设备. 2004, (1):26-31

　　2003年

　　30. Zou GS, Yang J, Wu AP, Huang GH, Zhang DK, Ren JL, Wnag Q . Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers. Journal of Materials and Technology.2003, 19(suppl.,1):189~192(SCI: 813HS, EI:04328307241)

　　29. 邹贵生, 吴爱萍, 任家烈, 等. Al/Ti/Al复合层原位生成金属间化合物连接陶瓷. 稀有金属材料与工程. 2003, 32(12): 981~985(SCI: 761 MK, EI: 04088029352)

　　28. 邹贵生, 杨俊, 吴爱萍, 任家烈, 等. 降低陶瓷与陶瓷或金属连接温度的技术. 宇航材料工艺. 2003, (1):1-3

　　27. 梁陈剑, 吴爱萍, 邹贵生. 基于B/S模式的远程焊接数值模拟系统. 焊接. (6):13-17, 2003

　　2002年

　　26. A.P.Wu, G.S.Zou, J.L.Ren, H.J.Zhang, G.Q.Wang, X.Liu, M.L.Xie. Microstructures and mechanical properties of Ti-24Al-17Nb (at.%) laser beam welding joints. Intermetallics, 2002 ,(10):647-651 (SCI: 583EE, EI: 02327046060)

　　25. 邹贵生, 吴爱萍, 任家烈, 等. 含金属间化合物的Al基合金半固态加压连接Si3N4陶瓷. 清华大学学报. 2002, 42(11):1433-1436(EI: 03107391472)

　　24. 吴爱萍, 邹贵生, 任家烈. 先进结构材料的发展及其钎焊连接技术的进展. 材料科学与工程，2002, 20(21):104-106

　　23. 李晓宁, 吴爱萍, 邹贵生. 基于B/S结构的材料焊接咨询系统. 焊接技术. 2002, 31(4):37-38

　　22. 任维佳, 吴爱萍, 赵海燕, 邹贵生. 大型电机转子焊接残余应力的数值分析. 焊接学报, 2002, 23(4):92-96

　　21. 邹贵生, 吴爱萍, 高守传, 杨俊, 李晓宁, 任家烈. Ag-Cu-Ti活性钎料真空钎焊钨、石墨与铜的研究. 新技术新工艺, 2002, (6):40-42

　　2001年

　　20. Zou Gui-sheng, Wu Ai-ping, REN Jia-lie. Solid-liquid state pressure bonding of Si3N4 ceramics with aluminum based alloys and its mechanism. Trans. Nonferrous Met. Soc. China. 2001, 11(2):178-182 (SCI: 419KB, EI: 01536784956)

　　19. Aaiping Wu, Guisheng Zou, Jialie Ren, Weijia Ren, Sheng Li. Heat resistant joints of Si3N4 ceramics with intermetallic compounds formed in situ. Journal of Mater. Sci. 2001, 36 : 2673-2678( SCI: 434VM, EI: 01336616224)

　　18. 邹贵生, 吴爱萍, 任家烈, 任维佳, 李盛. Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷与接头质量控制. 航空材料学报, 2001, 21(1):18-22. (EI: 04057991565)

　　17. 邹贵生, 吴爱萍, 任家烈, 任维佳, 李盛. Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷结合机理. 清华大学学报，2001, 41(4):51-54(EI: 02036826643)

　　16. 邹贵生, 吴爱萍, 任家烈, 任维佳, 梁陈剑. 高Tc氧化物陶瓷超导材料的连接研究现状与展望.材料导报，2001, 15(12): 27-28

　　15. 邹贵生, 吴爱萍, 任家烈, 高守传, 任维佳, 梁陈剑. 热核聚变关键结构件的连接技术.焊接技术，2001, 10(5):8-9.

　　14. 邹贵生, 吴爱萍, 任家烈, 曾文军, 彭真山, 李跃清. 用Al-Ti和Al-Zr 合金大气中连接Si3N4陶瓷. 焊接，2001, (3):13-15

　　13. 吴爱萍, 邹贵生, 任家烈. Ti-24Al-17Nb合金的激光焊接. 宇航材料工艺, 2001, 31(6):58-62

　　12. 李盛, 吴爱萍, 邹贵生, 任家烈. 复合陶瓷挺柱钎焊变形及其控制. 机械工程材料, 2001, 25(10):16-18

　　11. 吴爱萍, 梁陈剑, 邹贵生, 鹿安理, 赵海燕. 网络化敏捷制造. 机械工程师, 2001, (2):5-7

　　1996年-2000年

　　10. 邹贵生, 吴爱萍, 任家烈, 彭真山. 用Al、Al-3wt%Ti真空加压钎焊Si3N4陶瓷及接头的高温性能. 航空材料学报, 1999, 19(2): 48-53 ( EI: 99114905590)

　　9. 邹贵生, 吴爱萍, 任家烈, 李盛, 任维佳. 耐高温陶瓷接头的合金化-用Al/Ni/Al复合层连接Si3N4陶瓷. 材料导报, 2000, 14(4):61-63

　　8. 邹贵生, 吴爱萍, 任家烈, 任维佳, 李盛. 耐高温陶瓷接头的合金化-用Al/Ti/Al复合层连接Si3N4陶瓷. 新技术新工艺, 2000, (1):22-24

　　7. 吴爱萍,彭真山,邹贵生,任家烈. 复合陶瓷挺柱的钎焊质量控制. 热加工工艺，2000, (3):26-28

　　6. 邹贵生, 吴爱萍, 任家烈, 李盛, 任维佳. 连接压力在Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷中的作用机理. 宇航材料工艺, 2000, 30(5):76-80

　　5. 邹贵生, 吴爱萍, 任家烈. 用Al-Zr和Al-V合金加压钎焊Si3N4陶瓷. 焊接技术, 2000, (2):1-2

　　4. 邹贵生, 吴爱萍, 任家烈, 李盛, 任维佳. Al及其合金作钎料或中间层连接陶瓷-金属. 材料导报, 1999, 13(2):16-18

　　3. 邹贵生, 吴爱萍, 任家烈. 含Al、Ti、Zr的活性合金连接陶瓷时的防氧化. 焊接技术, 1999, (3):1-4

　　2. 邹贵生, 吴爱萍, 任家烈, 彭真山. 耐高温陶瓷-金属接头连接研究的现状及发展. 中国机械工程, 1999, 10(3):30-32

　　1. 邹贵生, 张相权. 10CrMo910钢厚壁管接头取消焊后热处理的研究. 焊接, 1996, (4):1-4

　　部分会议学术论文与报告

　　50. Y. Norman Zhou, Anming Hu, Lei Liu, Gui-sheng Zou. From Microjoining to Nanojoining. May 8-11,2012, The proceedings of International Welding/Joining Conference (IWJC-Korea 2012) (大会邀请报告), Jeju, Korea: 366 (ISBN 978-89-950091-8-5)

　　49. Guisheng Zou, Jianfeng Yan, Yingchuan Zhang, Luchan Lin, Aiping Wu, Jialie Ren, Jiuchun Yan, Anming Hu, Lei Liu, Y.Norman Zhou. Metal–metal bonding process using copper nanoparticle paste prepared by ployol method. The Program of Annual Meeting of Select Committee (SC) MICRO, 65th Annual Assembly & International Conference of the International Institute of Welding, Denver, Colorado, USA, 8-13July: 10

　　48. Jianfeng YAN, Guisheng ZOU, Yingchuan ZHANG, Luchan LIN, Aiping WU, Jialie REN, Jiuchun YAN, Lei LIU, Anming HU, Y.Norman ZHOU. Metal–metal bonding process using Cu-Ag mixed nanoparticle paste. The Final Program & Exhibition Directory of the Materials Science and Technology 2012 Conference & Exhibition(MS&T 2012) 【Joining of Advanced and Specialty Materials XIV (JASM)】，MS & T 2012, 16-22 Oct., Pittsburg, USA:112

　　47. Fengwen Mu, Guisheng Zou, Jianfeng Yan , Zhenyu Zhao , Aiping Wu , Jialie Ren , Jiuchun Yan, Lei Liu, Anming Hu, Y.Norman Zhou. Low temperature bonding through the sintering of Ag nanoparticles in-situ formed using micro-Ag2O composite paste for electronic packaging application. The Final Program & Exhibition Directory of the Materials Science and Technology 2012 Conference & Exhibition(MS&T 2012) 【Joining of Advanced and Specialty Materials XIV (JASM)】，MS & T 2012, 16-22 Oct., Pittsburg, USA

　　46. Jianfeng Yan, Guisheng Zou, Yingchuan Zhang, Luchan Lin, Aiping Wu, Jiuchun Yan, Anming Hu, Lei Liu, Y.Norman Zhou. Metal-metal Bonding Process using Metal Nanoparticle Paste Prepared by Polyol Method in Quantity. The Proceedings of the First International Conference on Nanojoining and Microjoining ( NMJ 2012), 2-5 Dec., Beijing, China: 113-114

　　45. Fengwen Mu, Guisheng Zou, Zhenyu Zhao, Jianfeng Yan, Hailin Bai, Aiping Wu, Jiuchun Yan, Lei Liu, Y.Norman Zhou. Bonding of Cu Bulks through the Low Temperature Sintering of Ag Nanoparticles in-situ Formed using Micro-Ag2O Composite Paste. The Proceedings of the First International Conference on Nanojoining and Microjoining ( NMJ 2012), 2-5 Dec., Beijing, China: 115-116

　　44. Fengwen Mu, Zhenyu Zhao, Guisheng Zou, Jianfeng Yan, Hailin Bai, Aiping Wu, Zhenguo Sun, Jiuchun Yan, Lei Liu, Y.Norman Zhou. The effects of Ag-coated Cu particles added into micro-Ag2O paste on the sintered joint performance, The Proceedings of NMJ 2012, 2-5 Dec., Beijing, China: 147-148

　　43. Yingchuan Zhang, Jianfeng Yan, Guisheng Zou, Luchan Lin, Dongyue Zhang, Aiping Wu, Zhenguo Sun, Lei Liu and Y.Norman Zhou. Low temperature sintering-bonding using mixed Cu+Ag nanoparticle paste for packaging application, The Proceedings of the First International Conference on Nanojoining and Microjoining ( NMJ 2012), 2-5 Dec., Beijing, China: 145-146

　　42. Wei Guo, Shanping Tang, Ying Zhu, Jianfeng Yan, Guisheng Zou, Y. Norman Zhou. A Study of Sintering Bonding Using Silver Nanowires Paste. The Proceedings of the First International Conference on Nanojoining and Microjoining ( NMJ 2012), 2-5 Dec., Beijing, China: 63-64

　　41. Luchan Lin, Jianfeng Yan, Lei Liu, Guisheng Zou, Yingchuan Zhang, Aiping Wu, Y. Norman Zhou. High temperature service property evaluation of Ag-Nanoparticle sintered Cu-Cu joints. The Proceedings of the First International Conference on Nanojoining and Microjoining ( NMJ 2012), 2-5 Dec., Beijing, China: 143-144

　　40. L. Liu, G. Zou, A. Hu, W. W. Duely, and Y. Zhou. Femtosecond laser welding for micro-device integration. The Proceedings of the First International Conference on Nanojoining and Microjoining ( NMJ 2012), 2-5 Dec., Beijing, China: 45-46

　　39. L. Liu, L. Quintino, G. Zou, A. Hu, and Y. Zhou. Heat Generation in Ag Nanowires Induced by Femtosecond Laser Irradiation. The Proceedings of the First International Conference on Nanojoining and Microjoining ( NMJ 2012), 2-5 Dec., Beijing, China: 81-82

　　38. Y. D. Huang, G. S. Zou, A. Pequegnat, and Y. Zhou. Porosity Formation Mechanism in Laser Microwelding of Pt-10%Ir to 316LVM Stainless Steel. The Proceedings of the First International Conference on Nanojoining and Microjoining ( NMJ 2012), 2-5 Dec., Beijing, China: 37-38

　　37. 张颖川，闫剑锋，LIU Lei，邹贵生，白海林，吴爱萍，闫久春，ZHOU Yunhong. 纳米银与纳米铜混合焊膏用于电子封装低温烧结连接. 第17届全国焊接学术会议暨第19届全国钎焊及特种连接技术交流会论文集，长沙，2012.10: 357-361(新人优秀论文奖)

　　36. 林路禅，闫剑锋，LIU Lei，邹贵生，吴爱萍，白海林，闫久春，ZHOU Yunhong. 高温服役对纳米银焊膏封装接头力学性能的影响. 第17届全国焊接学术会议暨第19届全国钎焊及特种连接技术交流会论文集，长沙，2012.10: 362-366

　　35. 母凤文，LIU Lei，邹贵生，赵振宇，吴爱萍，白海林，闫久春，ZHOU Yunhong. 含镀银铜粉的微米氧化银混合焊膏用于封装连接研究. 第17届全国焊接学术会议暨第19届全国钎焊及特种连接技术交流会论文集，长沙，2012.10: 367-371

　　34. 邹贵生. 纳米金属颗粒膏合成及其低温烧结连接的电子封装应用研究进展. 第17届全国焊接学术会议暨第19届全国钎焊及特种连接技术交流会，长沙，2012年10月 (第19届全国钎焊及特种连接技术交流会-大会特邀报告】

　　33. 李权, 丁敏, 吴爱萍, 邹贵生, 宋伟, 李剑. 电磁开关触头熔焊原因及其影响因素. 第17次全国焊接学术会议论文集，2012.10: 23-26，中国长沙

　　32. 邹贵生, Y.ZHOU, 闫剑锋, 吴爱萍, 刘磊, 母凤文, 林路禅, 张颖川, 张冬月, 赵振宇. 新兴的纳连接研究及其现状. 2012两岸清华大学学术研讨会，台湾，2012. 9.4-10 (基础科学及纳米科技领域-大会主题报告】

　　31. Aiping WU, Yue Zhao, Yutaka S. Sato, Guisheng Zou, Hiroyuki Kokawa. Wormhole defects in the friction stir welding joints of Invar 36 alloy with PCBN tool. Proceedings of The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2012). 28-30 November, 2012, the Hotel Hankyu Expo Park, Osaka, Japan

　　30. Quan Li, Min Ding, Aiping Wu, Guisheng Zou, Wei Song, Jian Li. Analysis of contact welding in solenoid switch and the anti-welding performance of some typical copper based contact materials. Proceedings of The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2012). 28-30 November,2012, the Hotel Hankyu Expo Park, Osaka, Japan

　　29. Ju Kang, Aiping WU, Guisheng Zou, Yanhua Zhao, Guoqing Wang. Investigation on the particle agglomeration behavior in friction stir welding of 2219-T6 aluminum alloy. Proceedings of The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2012). 28-30 November, 2012, the Hotel Hankyu Expo Park, Osaka, Japan

　　28. Jianfeng Yan，Guisheng Zou，Xiaoyu Wang，Hailin Bai，Fengwen Mu，Aiping Wu Large-Scale Synthesis of Ag Nanoparticles by Polyol Process for Low Temperature Bonding Application. 2011 International Conference on Electronic Packaging Technology & High Density Packaging：254-259(978-1-4577-1769-7/11/$26.00 ©2011 IEEE)(EI: 12345839)

　　27. Fengwen Mu, Guisheng Zou, Jianfeng Yan, Hailin Bai, Aiping Wu. A Study on The Low Temperature Sintering-Bonding through In-Situ Formation of Ag Nanoparticles Using Ag2O Microparticles. 2011 International Conference on Electronic Packaging Technology & High Density Packaging：293-301(978-1-4577-1769-7/11/$26.00 ©2011 IEEE)(EI:12345846)

　　26. Guisheng Zou, Jianfeng Yan, Fengwen Mu, Hailin Bai, Aiping Wu, Anming Hu, Y.Norman Zhou. Low temperature sintering- bonding with Cu NPs for electronic packaging application. Proceedings of the IIW International Conference on Global Trends in Joining, Cutting and Surfacing Technology. edited by D V Kulkarni, M Samant, S Krishnan, et al. Narosa Publishing House( ISBN 978-81-8687-152-4), 2011:761-764(邀请报告)