清华大学机械工程系博士研究生导师简介:邹贵生

2014-12-22 11:30:21来源:网络

  2012年

  114. Wei Guo, Zou Guisheng, Chai Xiao, Wu Aiping, Zheng Minghui, Jiao Yulei, Ren Jialie. The study of multiple thermal cycle of HTS YBCO bulk. Physica C 474, 2012:25-28 (SCI:901CL, EI: 20120814786656)

  113. G. Zou, Y.D. Huang, A. Pequegnat, X.G. Li, M.I. Khan, Y. Zhou. Crossed-wire Laser microwelding of Pt-10 Pct Ir to 316 low-carbon vacuum melted stainless steel: Part I. Mechanism of joint formation. Metall. Mater. Trans. A, 2012, 43(4): 1223-1233 (SCI: 000300520700012, EI:20121414929541)

  112. Y. D. Huang A.Pequegnat, G. S. Zou, J.C.Feng, M.I.Khan and Y. Zhou. Crossed-wire laser microwelding of Pt-10%Ir to 316 LVW stainless steel Part II: Effect of orientation on joining mechanism. Metall. Mater. Trans. A, 2012, 43(4): 1234-1243(SCI: 000300520700013, EI: 20121414929542)

  110. Jianfeng Yan, Guisheng Zou, Aiping Wu, Jialie Ren, Jiuchun Yan, Anming Hu, Lei Liu, Y.Norman Zhou. Effect of PVP on the low temperature bonding process using polyol prepared Ag nanoparticle paste for electronic packaging application. Journal of Physics: Conference Series 379 (2012) 012024:1-6 (IOP publishing: doi:10.1088/1742-6596/379/1/012024) (ECO-MATES) (SCI:BBO07, EI:20124415629351)

  109. Jianfeng Yan, Guisheng Zou, Aiping Wu, Jialie Ren, Anming Hu and Y.Norman Zhou. Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in Low Temperature Bonding Process with Silver Nanoparticles. Journal of Electronic Materials, 2012, 41(7): 1924-1930 (SCI:950NB, EI:20122515125902)

  106. Jianfeng Yan, Guisheng Zou, Aiping Wu, Jialie Ren, Anming Hu and Y.Norman Zhou. Polymer-Protected Cu-Ag mixed NPs for Low-Temperature Bonding application. Journal of Electronic Materials, 2012, 41(7): 1886-1892(SCI:950NB, EI: 20122515125912)

  106. Jianfeng Yan, Guisheng Zou, Ai-ping Wu, Jialie Ren, Jiuchun Yan, Anming Hu, Y.Zhou. Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging. Scripta Materialia, 2012, 66: 582-585 (SCI:912QY, EI:20120914825880)

  105. Xia Haiyang, Wu Aiping, Fan Yinglong, Zou Guisheng, Ren Jialie. Effects of ion implantation on the brazing properties of high purity alumina. Surface and Coatings Technology, 206(2012), 8-9: 2098-2014 (SCI: 894WP, EI20120114664019)

  2011年

  104. Xing Li, Zou Guisheng, Ke Liming, Wei Peng. Infuence of tool pin profile on the interface migration of friction stir lap joints. China Welding, 2011, 20(4): 6-11

  103. Jianfeng YAN, Guisheng ZOU, Anming HU, Y.Norman ZHOU. Preparation of polymer coated Cu NPs and its applications for Low-Temperature Bonding. Journal of Materials Chemistry, 2011,21:15981-15986 (SCI: 000295580800022, EI: 20114114414471)

  102. Guisheng ZOU, Jianfeng YAN, Fengwen MU, Aiping WU, Hailin BAI, Jialie REN, Anming HU, Y.Norman ZHOU. Low temperature bonding of Cu metal through sintering of Ag nanotparticles for high temperature packaging. The Open Surface Science Journal, 2011,3:70-75(Invited paper)

  101. Xiao Chai, Guisheng Zou, Wei Guo, Bailin Bai, Aiping Wu, Jialie Ren. Fast Joining YBCO bulks with melt Ag doped Y-Ba-Cu-O solder. China Welding, 2011, 20(1):12-16 (EI: 20112714112777)

  100 邹贵生, 闫剑锋, 母凤文, 吴爱萍, Zhou Y.Norman, 白海林, 任家烈. 微连接和纳连接的研究新进展. 焊接学报, 2011,32(4): 107-112, 118 (EI:20112214022456)

  99. Song Zhihua, Wu Aiping, Wang Guoqing, Zou Guisheng, Ren Jialie. Embrittlement of Ti-23Al-17Nb alloy laser welded joint at 650°C. Materials Science Forum, 675-677(2011): 743-746 (EI:20111113752288)

  98. 宋志华, 吴爱萍, 邹贵生, 王国庆. Ti3Al激光焊接接头EBSD试样的制备. 焊接学报,2011,32(5):93-96 (EI:20112514079551)

  97. 王国庆, 宋志华, 吴爱萍, 赵一夫, 邹贵生, 任家烈. Ti3Al激光焊接接头组织与织构的EBSD分析. 焊接学报, 2011,32(4):63-66 (EI:20112214022445)

  2010年

  96. X. Hu, G. Zou, S. J. Dong, M. Y. Lee, J. P. Jung and Y. Zhou. Effects of steel coatings on electrode life in resistance spot welding of galvannealed steel sheets. Materials Transactions, 2010, 51(12):2236-2242 (SCI: 721XE, EI: 20110613653349)

  95. Guo Wei, Zou Guisheng, Wu Aiping, Bai Hailin, Ren Jialie. Soldering of Bi-2223/Ag high temperature superconducting tapes with Sn-Pb-Bi-Ag alloy paste. Physica C, 2010, 470 :115-119 (SCI: 560PE, EI: 20100512676872)

  94. Chai Xiao, Zou Guisheng, Guo Wei, Wu Aiping, He Jiarun, Bai Hailin, Xiao Ling, Jiao Yulei, Ren Jialie. Fast joining of melt textured Y–Ba–Cu–O bulks with high quality. Physica C, 2010, 470 : 598-601 (SCI: 629QN, EI: 20102513020655)

  93. Guo Wei, Zou Guisheng, Chai Xiao, Wu Aiping, He Jiarun, Bai Hailin, Ren Jialie, Jiao Yulei Joining of textured YBCO with YBCO added Ag2O additive. Physica C, 2010, 470 : 482–486 (SCI: 616VI, EI: 20102413005113)

  92. 何佳闰, 邹贵生, 郭伟, 吴爱萍,白海林,柴筱,任家烈,郑明辉,肖玲. 钎焊YBCO高温超导块材研究. 材料热处理学报, 2010, 31(6): 13-17, 32(EI: 20102913086090)

  91. 郭 伟, 邹贵生, 何佳闰, 吴爱萍, 肖玲,郑明辉,焦玉磊,白海林,任家烈. YBCO超导块材超导性能高温失超及恢复. 清华大学学报, 2010, 50(2):187-190 (EI: 20103413174148)

  90. 周方兵, 邹贵生, 郭 伟, 吴爱萍, 任家烈, 白海林,宋秀华. 添加超导中间层扩散连接BSCCO带材. 低温物理学报, 2010, 32(2): 87-90

  89. 何佳闰, 邹贵生, 郭伟, 吴爱萍, 白海林,柴筱, 任家烈, 郑明辉, 肖玲. Ag箔钎焊YBCO高温超导块材. 低温物理学报, 2010, 32(1): 22-26

  88. 闫剑锋, 邹贵生, 李健, 吴爱萍. 纳米银焊膏的烧结性能及其用于连接铜的研究. 工程材料, 2010, 10:5-8

  2009年

  87. Guisheng ZOU, Erhu XIE, Hailin BAI, Aiping WU, Qing Wang, Jialie REN. A study on the TLP diffusion bonding of Ti-22Al-25Nb alloy. Materials Science and Engineering A 499, 2009: 101-105(SCI: 383VW, EI:084711718906)

  86. Guo Wei, Zou Guisheng, Wu Aiping,Wang Yanjun, Bai Hailin, Ren Jialie. Fabrication of non-superconducting and superconducting joints of Ag/Bi-2223 tapes by diffusion bonding. China Welding, 2009, 18(4): 1-5 (EI: 20100912741463)

  85. Guo Wei, Zou Guisheng, Wu Aiping, Wang Yanjun, Bai Hailin,Ren Jialie. Superconducting joint of Bi-2223/Ag superconducting tapes by diffusion bonding. Physica C, 2009, 469: 1898–1901(SCI: 504LR, EI: 20093712296907)

  84. Guo Wei, Zou Guisheng, Wu Aiping, Wang Yanjun, Bai Hailin,Ren Jialie. Study of air heat treatment on Bi-2223/Ag superconducting tapes. Physica C, 2009, 469: 778-781(SCI: 463DC, EI:20092312116155)

  83. 邹贵生, 周方兵, 白海林, 吴爱萍, 宋秀华. 高2223相含量粉末扩散连接BSCCO带材. 焊接学报,2009,30(1), 111-114(EI: 20091311987913)

  82. 郭伟, 邹贵生, 吴爱萍, 任家烈. 直接扩散连接制备多芯Bi系超导带材超导接头. 焊接学报, 2009, 30(2): 125-128(EI: 20091311987914)

  81. 邹贵生, 王延军, 吴爱萍, 白海林, 任家烈, 宋秀华, 宗军, 董宁波, 张宏杰, 王素丽. Bi-2223/Ag高温超导带材的有阻连接研究. 焊接, 2009, (3): 19-23

  80. 邹贵生, 郭伟, 何佳闰, 白海林, 郑明辉. 单畴钇系超导块材的扩散连接和钎焊技术. 焊接. 2009, (2):26-30

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